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spronkey | 5 years ago
Don't forget that scaling up is also not just about frequencies, there are also packaging considerations - the CPU dies have to actually be able to dissipate the heat generated, and the package itself has to be able to do so as well. I'd expect that this is something AMD and especially Intel have a leg up over Apple with - although, considering they've already tread that ground it makes Apple's job a bit easier too.
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