top | item 36374529

(no title)

OliverGuy | 2 years ago

I suppose that the packaging problem can be solved - up to a point - with stacking vertically as well as placing them next to the io die. Wonder how well that will scale, could we stack multiple chiplets high? What effect would that have on thermals?

discuss

order

_hypx|2 years ago

Vertical chip stacking is another idea being proposed. But as you said, that will have thermal problems.

It could be possible to stack less power-hungry chips like cache chips, but probably not the main CPU/GPU core. It will just be another way of extending Moore’s Law.

voldacar|2 years ago

What if you added tiny hollow channels between each layer of stacked chiplets and pumped coolant through them at high pressure

bravetraveler|2 years ago

Would the X3D cache setup for the newer AMD CPUs count as vertical chips?

I'm a bit naive of the actual... physical bits. I'm not clear what makes a chip, and if the cache would be that - or something a bit simpler