I suppose that the packaging problem can be solved - up to a point - with stacking vertically as well as placing them next to the io die. Wonder how well that will scale, could we stack multiple chiplets high? What effect would that have on thermals?
_hypx|2 years ago
It could be possible to stack less power-hungry chips like cache chips, but probably not the main CPU/GPU core. It will just be another way of extending Moore’s Law.
voldacar|2 years ago
bravetraveler|2 years ago
I'm a bit naive of the actual... physical bits. I'm not clear what makes a chip, and if the cache would be that - or something a bit simpler
jackmott|2 years ago
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