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aDfbrtVt | 2 years ago
Other factors can include reduced routing complexity and area requirements of HD since you have to shuffle around soft information. Extra die space is expensive so you want to avoid it if possible.
However, I think the most likely is the latency reduction you get when using HD-FEC. I know that some applications of microwave links are extremely latency sensitive, could be that this research is targeting one of those applications.
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