[654wak654]

Sounds like a response to Intel's 18A process [0], which is also coming in 2026.

[0] https://www.tomshardware.com/tech-industry/manufacturing/int...

[HarHarVeryFunny]

Intel is the one trying to catch up to TSMC, not vice versa!

The link you give doesn't have any details of Intel's 18A process, including no indication of it innovating in any way, as opposed to TSMC with their "backside power delivery" which is going to be critical for power-hungry SOTA AI chips.

[shookness]

While you are correct that it is Intel trying to catch TSMC, you are wrong about the origin of backside power delivery. The idea originated at Intel sometime ago, but it would be very ironic if TSMC implements it before Intel...

[s3p]

OP never said Intel wasn't trying to catch up. As far as backside power delivery, this is literally what Intel has been working on. It is called PowerVia.

https://www.intel.com/content/www/us/en/newsroom/news/powerv...

[hinkley]

Except for backside power. Intel published and had a timeline to ship at least one generation ahead of TSMC. I haven’t been tracking what happened since, but Intel was ahead on this one process improvement. And it’s not a small one, but it doesn’t cancel out their other missteps. Not by half.

[ajross]

This isn't a comparison of shipping processes though, it's just roadmap products. And in fact until this announcement Intel was "ahead" of TSMC on the 2026 roadmap.

[Alifatisk]

This is a response to something that’s coming in 2 years? Incredible how far ahead they are

[tgtweak]

Fabs have a 3+ year lead time from prototyping the node to having it produce production wafers.

[blackoil]

This will also come in 2026, so not that far ahead.