There's a lot of chip packaging in Taiwan, Malaysia, and maybe Singapore so these A16s are probably racking up frequent flier miles. Probably not China though.
I think "for assembly" here means iPhone assembly, ie. the final SoC will be sent to China to assemble the iPhone. I don't think GP is referring to packaging.
wmf|1 year ago
In the future they will probably be packaged in the US: https://www.apple.com/newsroom/2023/11/apple-announces-expan...
joshstrange|1 year ago
ClassyJacket|1 year ago
cududa|1 year ago
fngjdflmdflg|1 year ago
VWWHFSfQ|1 year ago
dang|1 year ago
We've had to ask you this before (https://news.ycombinator.com/item?id=35998957), so if you wouldn't mind reviewing https://news.ycombinator.com/newsguidelines.html and taking the intended spirit of the site more to heart, we'd be grateful.
chipdude1973|1 year ago
1. The output of a "chip manufacturing" process is a wafer. There is absolutely further assembly (bonding, packaging) done on this output.
2. The chips themselves are not for the end user's consumption. They are assembled into a product, a "consumer electronic".
btbuilder|1 year ago