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greenknight | 1 year ago
https://www.tsmc.com/english/dedicatedFoundry/manufacturing/....
TSMC produced in 2023 16 million wafers, apples die size is about 105mm2 which fits around 230 chips per wafer... say its 200 good chips... thats 3.2 billion chips.
3.2B to 120k is a rounding error.
parhamn|1 year ago